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		<title>CSP on Infrared Quartz Heating Systems</title>
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				<title>晶圆级CSP 芯片级封装 加热器</title>
				<link>http://ir-quartz-heater.com/zh/posts/wafer-level-csp-chip-scale-package-heater/</link>
				<pubDate>Tue, 02 Jun 2026 04:02:29 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-quartz-heater.com/images/eeeb9669114c0c0a0b2bef3f902d01a9.png&#34; alt=&#34;晶圆级CSP 芯片级封装 加热器&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在包装线上，片上级CSP对热漂移没有容忍余地。光刻胶软烘或封装固化过程中半度的温度波动，可能导致关键尺寸变化，产率流失，并使晶圆重新进入昂贵的返工流程。我们设计的片上级CSP加热器旨在从源头消除这种不确定性。&lt;/p&gt;</description>
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